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Memory Solutions for Flexible Thin-Film Logic: Up to 8kb, >105.9kb/s LPROM and SRAM with Integrated Timing Generation Meeting the ISO NFC Standard
- Source :
- Digest of Technical Papers-IEEE International Solid-State Circuits Conference, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019, 17 February 2019 through 21 February 2019, 206-208
- Publication Year :
- 2019
- Publisher :
- Institute of Electrical and Electronics Engineers Inc., 2019.
-
Abstract
- © 2019 IEEE. Thin-film transistor (TFT) technologies have long been used predominantly for display fabrication and are attractive for large area, low cost and flexible circuit applications. Thanks to the improving performance of thin-film metal-oxide NFC tags and data processing chips on foil [1], [2], fabs are considering the large-scale production of flexible logic circuits. However, these systems require a memory, but metal-oxide technology lacks reliable, large memory arrays. Today, data storage is limited to ROMs, flipflops and SRAMs. No memory array has been demonstrated with sufficient storage capacity and speed within the typical power and area budget. This paper demonstrates the first large, fast and low-power memory array in flexible metal-oxide technology, comparable to the Si Intel 4000 series in the seventies [3]. ispartof: pages:206-+ ispartof: 2019 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC) vol:62 pages:206-+ ispartof: IEEE International Solid- State Circuits Conference (ISSCC) location:CA, San Francisco date:17 Feb - 21 Feb 2019 status: published
- Subjects :
- Technology
Low-power memory
Thin films
Budget control
Storage capacity
Hardware_PERFORMANCEANDRELIABILITY
Static random access storage
Engineering
Metallic compounds
Flexible thin films
Timing circuits
Hardware_INTEGRATEDCIRCUITS
Flexible circuit
Data storage
ISO Standards
Thin film metal
Science & Technology
Thin film transistors
Engineering, Electrical & Electronic
Computer circuits
Data handling
Thin film circuits
Flexible displays
Metals
Improving performance
Large scale productions
Memory architecture
Hardware_LOGICDESIGN
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Journal :
- Digest of Technical Papers-IEEE International Solid-State Circuits Conference, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019, 17 February 2019 through 21 February 2019, 206-208
- Accession number :
- edsair.dedup.wf.001..21958057782920e0ea9b935e40e04699