Industrial‐grade 2‐μm ultrafast fiber laser CPA for silicon processing

A novel compact laser utilizing thulium‐based fiber chirped‐pulse amplification (CPA) technology has been developed to enable essential tasks such as microwelding or the precision cutting of filaments with semiconductors such as silicon. At a central wavelength of 2 μm, the activeTwo‐15 provides pulse energies exceeding 100 μJ and an average power output surpassing 15 W, and can be seamlessly integrated into systems for materials processing.