Ultraviolet line structuring of large solar wafers

Ultrashort‐pulsed lasers are ideal for material processing by welding, marking, and cutting. Scanning systems are crucial for large substrates. We introduce a novel UV line structuring method using deformable mirror technology and freeform optics. This approach aims to improve processing times on large substrates, especially for M12 solar wafer processing. By using a freeform lens and a Zwobbel deformable mirror, we achieve extended processing fields and high scan frequencies. The paper explores optical designs, their robust optomechanical implementation for prototyping, and setup characterization.