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Failure Mechanism Analysis of Single-Event Effect in 4H-SiC Inverters

Authors :
Gu, Yong
Yang, Yurui
Ma, Jie
Wen, Hongyang
Hou, Xiangyu
Hong, Jingjing
Yang, Lanlan
Wei, Jiaxing
Liu, Ao
Huang, Runhua
Bai, Song
Zhang, Long
Liu, Siyang
Sun, Weifeng
Source :
IEEE Transactions on Electron Devices; October 2024, Vol. 71 Issue: 10 p5914-5918, 5p
Publication Year :
2024

Abstract

The failure mechanism of single-event burnout (SEB) in 4H-SiC inverter is studied by experiments and simulations. The most sensitive location for heavy ions striking in the 4H-SiC inverter circuit has been identified by pulsed laser experiments. Experimental results demonstrate that the maximum linear energy transfer (LET) value that the 4H-SiC inverter circuit can withstand is exceeding 64.07 MeV<inline-formula> <tex-math notation="LaTeX">$\cdot $ </tex-math></inline-formula> cm<superscript>2</superscript>/mg but not surpassing 92.25 MeV<inline-formula> <tex-math notation="LaTeX">$\cdot $ </tex-math></inline-formula> cm<superscript>2</superscript>/mg. Sentaurus TCAD is utilized to reveal the failure mechanism. The incident heavy-ion radiation triggers the activation of parasitic p-n-p and n-p-n transistors, resulting in a latch-up phenomenon within the circuit, consequently leading to the circuit burnout. The revealed failure mechanism gives a guidance for further hardened circuits design.

Details

Language :
English
ISSN :
00189383 and 15579646
Volume :
71
Issue :
10
Database :
Supplemental Index
Journal :
IEEE Transactions on Electron Devices
Publication Type :
Periodical
Accession number :
ejs67507566
Full Text :
https://doi.org/10.1109/TED.2024.3441555