Two-Dimensional Kinetic Simulation of the Post-Arc Plasma Dissipation Process of Vacuum Circuit Breaker Influenced by Transverse Magnetic Field

In this paper, the influence of the transverse magnetic field (TMF) on the post-arc residual plasma dissipation process of vacuum circuit breaker (VCB) is investigated by simulation. A two-dimensional (2D) particle-in-cell (PIC)/ Monte-Carlo collisional (MCC) model of the post-arc plasma dissipation process is established. Firstly, the influences of the TMF on the plasma motion are analyzed. The results indicate that the TMF enhances the ion velocity, thereby facilitating the plasma dissipation. In addition, the model was improved by considering the particle collision process. It was found that the TMF increases collisions and produces more charged particles, which hinders plasma dissipation. Finally, as the TMF affects the movement and collisions of particles, the time for the plasma dissipation initially decreases, then rises as the TMF increases from 0 mT to 400 mT. The minimum dissipation time occurs at 100 mT, with Cu⁺ taking 1.47 µs and electrons taking 1.14 µs. This work could help to improve the breaking ability of the VCB.