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Enhancing the Delamination Efficiency of Polyimide–Copper Bilayers with UV/Heat-Activated Foamable Adhesive: Insights and Applications

Authors :
Khawdas, Wichean
Sawada, Yuko
Miyata, Ken
Okamura, Haruyuki
Taki, Kentaro
Ito, Hiroshi
Source :
ACS Applied Materials & Interfaces; June 2024, Vol. 16 Issue: 24 p31788-31797, 10p
Publication Year :
2024

Abstract

This study explores the adhesive properties of copolymers comprising glycidyl methacrylate (GMA) and 3-(trimethoxysilyl)propyl methacrylate (MPTMS), focusing on their suitability for adhesive applications. Peel resistance measurements revealed a substantial impact of the GMA/MPTMS ratio on adhesion capabilities, identifying an optimal ratio of 30/70 for copolymerization with tert-butyl acrylate (tBA) to improve foaming performance. tBA, a foaming monomer activated by a photoacid generator and heat, enhances the copolymerized adhesive’s adhesion strength and foamability for postuse delamination. Chemical structure analysis through Nuclear magnetic resonance (NMR) and Fourier-transform infrared spectroscopy (FTIR) confirmed successful polymerization, while rheological properties indicated decreased complex viscosity and adhesive strength with an increasing tBA content. The deprotection of the t-butyl group facilitated foam formation, supported by morphology analysis. These findings provide insights into foamable adhesive development with potential applications in delamination processes and implications for further exploration in polymer adhesion.

Details

Language :
English
ISSN :
19448244
Volume :
16
Issue :
24
Database :
Supplemental Index
Journal :
ACS Applied Materials & Interfaces
Publication Type :
Periodical
Accession number :
ejs66589227
Full Text :
https://doi.org/10.1021/acsami.4c04417