Ultra-high throughput electron beam lithography for wafer size nanoimprint mold fabrication

MLA

Kojima, Yosuke, et al. “Ultra-High Throughput Electron Beam Lithography for Wafer Size Nanoimprint Mold Fabrication.” Proceedings of SPIE, vol. 12915, no. 1, Sept. 2023, pp. 1291507-1291507–6. EBSCOhost, https://doi.org/10.1117/12.2684952.

APA

Kojima, Y., Ito, T., Watanabe, T., Nagai, S., Youn, S., Suzuki, K., & Hiroshima, H. (2023). Ultra-high throughput electron beam lithography for wafer size nanoimprint mold fabrication. Proceedings of SPIE, 12915(1), 1291507-1291507–6. https://doi.org/10.1117/12.2684952

Chicago

Kojima, Yosuke, Takaomi Ito, Takumi Watanabe, Satoshi Nagai, Sung-won Youn, Kenta Suzuki, and Hiroshi Hiroshima. 2023. “Ultra-High Throughput Electron Beam Lithography for Wafer Size Nanoimprint Mold Fabrication.” Proceedings of SPIE 12915 (1): 1291507-1291507–6. doi:10.1117/12.2684952.