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Study on low-power test data compression method for 3D chips
- Source :
- Proceedings of SPIE; July 2023, Vol. 12744 Issue: 1 p127440F-127440F-7, 1146968p
- Publication Year :
- 2023
Details
- Language :
- English
- ISSN :
- 0277786X
- Volume :
- 12744
- Issue :
- 1
- Database :
- Supplemental Index
- Journal :
- Proceedings of SPIE
- Publication Type :
- Periodical
- Accession number :
- ejs63605790
- Full Text :
- https://doi.org/10.1117/12.2688769