High-speed wafer magnetic field inspection for semiconductor manufacturing

MLA

Robinson, John C., et al. “High-Speed Wafer Magnetic Field Inspection for Semiconductor Manufacturing.” Proceedings of SPIE, vol. 12053, no. 1, May 2022, p. 120530G–120530G–9. EBSCOhost, https://doi.org/10.1117/12.2614750.

APA

Robinson, J. C., Sendelbach, M. J., Ueyama, S., Kim, J., Numata, M., Kim, W., Kim, I., & Lee, M. (2022). High-speed wafer magnetic field inspection for semiconductor manufacturing. Proceedings of SPIE, 12053(1), 120530G–120530G–9. https://doi.org/10.1117/12.2614750

Chicago

Robinson, John C., Matthew J. Sendelbach, Shinji Ueyama, Jinseob Kim, Mitsunori Numata, Wookrae Kim, Ingi Kim, and Myungjun Lee. 2022. “High-Speed Wafer Magnetic Field Inspection for Semiconductor Manufacturing.” Proceedings of SPIE 12053 (1): 120530G–120530G–9. doi:10.1117/12.2614750.