Back to Search Start Over

Joining Photovoltaic Cell Connection Strips Using Ultra-Acoustic Wave - Resistive Hybrid Heating System

Authors :
Țunescu, Traian
Filipciuc, Andreea
Ştefan, Iulian
Sîrbu, Nicușor-Alin
Savu, Ionel Dănuț
David, Andrej
Savu, Sorin Vasile
Olei, Adrian Bebe
Source :
Advanced Materials Research; June 2022, Vol. 1172 Issue: 1 p57-65, 9p
Publication Year :
2022

Abstract

The manufacture of photovoltaic panels for the production of sustainable energy also involves the stage of electrical connection of the cells in the panel structure. This electrical connection is made by soldering of copper strips on the negative electrode of the cell. During the bonding process, due to the temperature of approximately 220-240°C at which the connecting strip is continuously heated, cracking processes of the upper layer of glass from the cell surface were identified. For this reason, it is necessary either to heat to lower temperatures, a solution that is not viable due to the melting temperature of the solder alloy which usually exceeds 210°C, or a different dosing of the heat flux. The solution proposed in the paper is to create a variable heat flux that allows the melting of the solder alloy, but at the same time to reduce the thermal load of the glass support layer. Through the proposed variant, the energy dosing is done with the help of a heating system consisting of two sources, an ultra-acoustic energy source and a classical resistive source. The resistive source provides an amount of energy to ensure a temperature in the range of 60-140°C, the difference to the melting point of the solder alloy being transferred locally by ultrasonic pulses. Research has highlighted the need to limit the range of values of the pressure of the circular sonotrode, which positively influences the mechanical stress of the photovoltaic cell, but also leads to a reduction in the joining speed. The dosing of the two components of the total energy, the one coming from the resistive source and the one coming from the ultra-acoustic vibration source is decisive for the efficiency of the joining process and for the quality of the soldered joint. Microscopic analyses revealed micro-cracks of the glass surface layer at forces higher than 100 N. Areas with lack of soldering for resistive heating at temperatures lower than 130oC were highlighted, the difference of 90-110°C being achieved by the contribution of ultra-acoustic energy.

Details

Language :
English
ISSN :
10226680
Volume :
1172
Issue :
1
Database :
Supplemental Index
Journal :
Advanced Materials Research
Publication Type :
Periodical
Accession number :
ejs60274190
Full Text :
https://doi.org/10.4028/p-jj4i32