A comparative study between Ag-CuO/ epoxy and Mg-CuO/ epoxy hybrid nanocomposites: impressive electrical, mechanical and thermal properties

Herein, a comparative study (Structural, Thermal, Mechanical, and Electrical) between the Neat-epoxy resin polymer matrix and the epoxy resin polymer decorated with (Ag-CuO) nanoparticles (NPs) and (Mg-CuO) nanosheets, has been done in order to provide the advantages of the incorporation of the CuO nanofillers into the epoxy resin polymer. Hybrid nanocomposites of Ag-CuO/Epoxy and Mg-CuO/Epoxy have been constructed via coprecipitation reaction. The average crystal, chemical, and morphological structures of Ag-CuO/Epoxy and Mg-CuO/Epoxy hybrid nanocomposites, as well as their constituent individual phases and epoxy matrix have been characterized by X-ray diffraction (XRD), Fourier Transform Infrared Spectroscopy (FTIR), Brunauer–Emmett–Teller (BET), High Resolution Transmission Electron Microscopy (HRTEM), and Field Emission Scanning Electron Microscopy (FESEM). It was observed that the coupling between (Ag-CuO) NPs or (Mg-CuO) nanosheets, and the epoxy networks improved the physical/chemical characteristics of the Neat-Epoxy by giving it a new fascinating performance that meets the advanced applications needs. Mg-CuO nanofillers changed the epoxy plastic behavior to show the ductile property. (Ag-CuO) NPs improved the epoxy thermal stability, electrical conductivity, dielectric constant, and lowest its activation energy. The Ag-CuO/Epoxy nanocomposite can be a low-cost candidate for use in many electronic applications. While, Mg-CuO/Epoxy had a wider elasticity region in the stress-strain curve. Finally, the hybrid nanocomposite between the Neat-Epoxy and (Ag/Mg-CuO) NPs introduces the solution for more functional applications, than the individual constituent phases and the matrix.