High-κ Polyimide-Based Dielectrics by Introducing a Functionalized Metal–Organic Framework

In this work, novel metal–organic framework/polyimide (MOF/PI) composite films possessing dielectric properties were synthesized via a solution blending method. UiO-66 and UiO-66–NH2nanoparticles were first prepared by a hydrothermal method and added into PI to obtain the composite films. Compared with pure PI, the dielectric properties of the MOF/PI composites were substantially enhanced. The amine functionalization gave UiO-66–NH2/PI composite films better dielectric properties in comparison with UiO-66/PI composite films because of improved interaction between PI and UiO-66–NH2. It showed that the dielectric constant of the PI composite film containing 20 wt% UiO-66–NH2is 8.8 at 102Hz, which was approximately 2.5 times that of the pure PI (3.5 at 102Hz). The dielectric loss of the composite film was less than 0.034. Moreover, the breakdown strength of 20 wt% UiO-66–NH2/PI composite films was found to be 208 kV/mm. We describe this new perspective for the preparation of high-performance polymer-based dielectric materials and their application as electrical materials.