High-efficiency vertically-emitting chipsets for 3D and proximity sensing

MLA

Zediker, Mark S., et al. “High-Efficiency Vertically-Emitting Chipsets for 3D and Proximity Sensing.” Proceedings of SPIE, vol. 11668, no. 1, Mar. 2021, p. 116680R–116680R–10. EBSCOhost, https://doi.org/10.1117/12.2577229.

APA

Zediker, M. S., Nechay, K., Ulkuniemi, R., Filipchuk, A., Hartikainen, T., Kaivosoja, V., Hietikko, R., Nikkinen, J., Sillanpaa, J., Melanen, P., Vilokkinen, V., Talmila, S., & Uusimaa, P. (2021). High-efficiency vertically-emitting chipsets for 3D and proximity sensing. Proceedings of SPIE, 11668(1), 116680R–116680R–10. https://doi.org/10.1117/12.2577229

Chicago

Zediker, Mark S., K. Nechay, R. Ulkuniemi, A. Filipchuk, T. Hartikainen, V. Kaivosoja, R. Hietikko, et al. 2021. “High-Efficiency Vertically-Emitting Chipsets for 3D and Proximity Sensing.” Proceedings of SPIE 11668 (1): 116680R–116680R–10. doi:10.1117/12.2577229.