Effect of Sn on the Characteristic Solidification Temperatures of AlSi6Cu4 Alloy

The solidification path of AlSi6Cu4 alloy with various content of Sn has been investigated using cooling curve techniques. The content of Sn has been varied from 0 to 500 ppm. The hardness of as cast alloys with different content of Sn has been measured. The results show that Sn in synthetically designed AlSi6Cu4 alloy (very low level of other elements) precipitate isolated. The increased content of Sn decreases significantly the solidus temperature of this alloy, prolonging its solidification temperature interval for approximately 9K. The hardness of this alloy has been reduced for about 20% by presence of Sn up to 500 ppm.