3D printed assembly and software development for silicon photonics sensor device measurement

MLA

Kawanishi, Tetsuya, et al. “3D Printed Assembly and Software Development for Silicon Photonics Sensor Device Measurement.” Proceedings of SPIE, vol. 11331, no. 1, Mar. 2020, p. 113310E–113310E–8. EBSCOhost, https://doi.org/10.1117/12.2553021.

APA

Kawanishi, T., Kanprachar, S., Anukool, W., Mankong, U., Ittipratheep, N., Udomsom, S., Mankong, U., Chamsuk, P., Bouthwong, A., Anukool, W., Umezawa, T., & Matsumoto, A. (2020). 3D printed assembly and software development for silicon photonics sensor device measurement. Proceedings of SPIE, 11331(1), 113310E–113310E–8. https://doi.org/10.1117/12.2553021

Chicago

Kawanishi, Tetsuya, Surachet Kanprachar, Waranont Anukool, Ukrit Mankong, N. Ittipratheep, S. Udomsom, U. Mankong, et al. 2020. “3D Printed Assembly and Software Development for Silicon Photonics Sensor Device Measurement.” Proceedings of SPIE 11331 (1): 113310E–113310E–8. doi:10.1117/12.2553021.