Studies of Wafer Backside Micro-arcing Prevention In Encore Ta Process

MLA

Chen, Andy, et al. “Studies of Wafer Backside Micro-Arcing Prevention In Encore Ta Process.” ECS Transactions, vol. 18, no. 1, Mar. 2009, pp. 601–04. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edo&AN=ejs52651740&authtype=sso&custid=ns315887.

APA

Chen, A., Bian, A., Lin, C., Xing, C., & Zhou, H. (2009). Studies of Wafer Backside Micro-arcing Prevention In Encore Ta Process. ECS Transactions, 18(1), 601–604.

Chicago

Chen, Andy, Allen Bian, Chang Lin, Charles Xing, and Hua Zhou. 2009. “Studies of Wafer Backside Micro-Arcing Prevention In Encore Ta Process.” ECS Transactions 18 (1): 601–4. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edo&AN=ejs52651740&authtype=sso&custid=ns315887.