Back to Search
Start Over
CMP for Cu Interconnect with Advanced Barrier Materials
- Source :
- ECS Transactions; October 2010, Vol. 33 Issue: 12 p147-155, 9p
- Publication Year :
- 2010
-
Abstract
- In this paper, we discuss CMP technology for Cu interconnects with a Co seed enhancement liner (SEL) and Cu with a Ru barrier. Typical forms of galvanic corrosion for each type of barrier are also reviewed. To meet CMP performance requirements, specific polishing and cleaning processes for each CMP step were developed. The overall performance of CMP was evaluated using a variety of patterned wafers, and results are presented.
Details
- Language :
- English
- ISSN :
- 19385862 and 19386737
- Volume :
- 33
- Issue :
- 12
- Database :
- Supplemental Index
- Journal :
- ECS Transactions
- Publication Type :
- Periodical
- Accession number :
- ejs52649330