The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects

MLA

Cao, Lu, et al. “The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects.” ECS Transactions, vol. 34, no. 1, Mar. 2011, pp. 787–92. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edo&AN=ejs52648008&authtype=sso&custid=ns315887.

APA

Cao, L., Xing, C., Xu, N., Zhou, H., Bian, A., & Lin, P. (2011). The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects. ECS Transactions, 34(1), 787–792.

Chicago

Cao, Lu, Charles Xing, Neil Xu, Hua Zhou, Allen Bian, and Paulchang Lin. 2011. “The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects.” ECS Transactions 34 (1): 787–92. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edo&AN=ejs52648008&authtype=sso&custid=ns315887.