Letter from the editor

Hello! We are pleased to bring you the 3rd Quarter 2017 issue of the IEEE EMC Magazine. We have a sneak peek of some activity at the 2017 IEEE International Symposium on EMC, Signal and Power Integrity (EMC+SIPI) held in Washington, DC over August 7-11. Chair Mike Violette and his committee organized an outstanding symposium. You can read about some of the symposium activity in the President’s Message, Chapter Chatter (Chicago’s summary), EMC Standards Activities, iNARTE Informer, and the Board of Directors Activities columns. Note in the Signal Integrity column, Associate Editor Jun Fan has brought us the winner of the Best SIPI Paper Award presented at this year's symposium. Titled, “A Novel Z-Directed Embedded Component for the Reduction of Voltage Ripple on the Power Distribution Network for PCBs”, the paper is by a team of highly regarded authors from the EMC Laboratory at the Missouri University of Science and Technology and Lexmark. You can find it starting on page 91.