Packaging of ultra-high speed optical fiber data interconnects

MLA

Dorosz, Jan, et al. “Packaging of Ultra-High Speed Optical Fiber Data Interconnects.” Proceedings of SPIE, vol. 10325, no. 1, Feb. 2017, p. 103250R–103250R–8. EBSCOhost, https://doi.org/10.1117/12.2271032.

APA

Dorosz, J., Romaniuk, R. S., Zoldak, M., Halmo, L., Turkiewicz, J. P., Schumann, S., & Henker, R. (2017). Packaging of ultra-high speed optical fiber data interconnects. Proceedings of SPIE, 10325(1), 103250R–103250R–8. https://doi.org/10.1117/12.2271032

Chicago

Dorosz, Jan, Ryszard S. Romaniuk, Martin Zoldak, Leos Halmo, Jaroslaw P. Turkiewicz, Stefan Schumann, and Ronny Henker. 2017. “Packaging of Ultra-High Speed Optical Fiber Data Interconnects.” Proceedings of SPIE 10325 (1): 103250R–103250R–8. doi:10.1117/12.2271032.