Suppressing Crack Formation in Particulate Systems by Utilizing Capillary Forces

Cracks, formed during the drying of particulate films, can reduce the effectiveness or even render products useless. We present a novel, generic approach to suppress crack formation in thin films made from hard particle suspensions, which are otherwise highly susceptible to cracking, using the capillary force between particles present when a trace amount of an immiscible liquid is added to a suspension. This secondary liquid preserves the particle cohesion, modifying the structure and increasing the drying rate. Crack-free films can be produced at thicknesses much greater than the critical cracking thickness for a suspension without capillary interactions, and even persists after sintering. This capillary suspension strategy is applicable to a broad range of materials, including suspensions of metals, semiconductive and ceramic oxides, or glassy polymeric particles, and can be easily implemented in many industrial processes since it is based on well-established unit operations. Promising fields of application include ceramic foils and printed electronic devices.