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Conductor backed and shielded multi-layer coplanar waveguide designs on LTCC for RF carrier boards for packaging PICs
- Source :
- Proceedings of SPIE; April 2016, Vol. 9891 Issue: 1 p98911Q-98911Q-9, 890209p
- Publication Year :
- 2016
Details
- Language :
- English
- ISSN :
- 0277786X
- Volume :
- 9891
- Issue :
- 1
- Database :
- Supplemental Index
- Journal :
- Proceedings of SPIE
- Publication Type :
- Periodical
- Accession number :
- ejs39742599
- Full Text :
- https://doi.org/10.1117/12.2225962