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High density interconnect substrates using multilayer thin film technology on laminate substrates MCMSLD
- Source :
- Microelectronics International; December 2001, Vol. 18 Issue: 3 p36-42, 7p
- Publication Year :
- 2001
Details
- Language :
- English
- ISSN :
- 13565362
- Volume :
- 18
- Issue :
- 3
- Database :
- Supplemental Index
- Journal :
- Microelectronics International
- Publication Type :
- Periodical
- Accession number :
- ejs364742
- Full Text :
- https://doi.org/10.1108/EUM0000000005830