Effect of Wood Moisture Content in Edge Glued Panel Bonding for Furniture Industry: Analysis of Shear-Stress and Rupture in Bondline

The objective of this article was to study the influence of the Pinus taeda wood moisture content to the production of EGP (Edge Glued Panel) in the bonding stage, using PVA adhesive. It was analyzed the joint resistances through shear-stress tests and rupture in the bondline. The wood moisture classes adopted to the panels were: “A” ( [8%, 9%[ ), “B” ( [9%, 10%[ ), “C” ( [10%, 11%[ ), “D” ( [11%, 12%[ ) e “E” ( [12%, 13%[ ). After the panel production, it was sawn the specimens for the resistance shear in the bondline tests by traction. The tests results show that it was statistically significant differences to the values of rupture tensions between A class and B, C, D and E classes. The wood medium rupture presented a tendency to reduce with the moisture increase, and the total rupture in the bondline presented a small tendency of a less number of occurrences with the rupture tension increases.