Analysis on dynamic tensile extrusion behavior of UFG OFHC Cu

MLA

Park, Tae, et al. “Analysis on Dynamic Tensile Extrusion Behavior of UFG OFHC Cu.” IOP Conference Series: Materials Science and Engineering, vol. 63, no. 1, Aug. 2014, p. 012144. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edo&AN=ejs33544643&authtype=sso&custid=ns315887.

APA

Park, T., Park, L., Jun, H., Bong, S., and, K., & Soo, C. (2014). Analysis on dynamic tensile extrusion behavior of UFG OFHC Cu. IOP Conference Series: Materials Science and Engineering, 63(1), 012144.

Chicago

Park, Tae, Leeju Park, Hak Jun, Seok Bong, Kim and, and Chong Soo. 2014. “Analysis on Dynamic Tensile Extrusion Behavior of UFG OFHC Cu.” IOP Conference Series: Materials Science and Engineering 63 (1): 012144. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edo&AN=ejs33544643&authtype=sso&custid=ns315887.