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Investigation of the plasma treatment in a multistep TiN MOCVD process

Authors :
Riedel, S.
Schulz, S.E.
Gessner, T.
Source :
Microelectronic Engineering; 2000, Vol. 50 Issue: 1 p533-540, 8p
Publication Year :
2000

Details

Language :
English
ISSN :
01679317
Volume :
50
Issue :
1
Database :
Supplemental Index
Journal :
Microelectronic Engineering
Publication Type :
Periodical
Accession number :
ejs2932128
Full Text :
https://doi.org/10.1016/S0167-9317(99)00324-X