Modal Analysis for Swing-Arm of LED Die Bonder

Led die bonder used for bond lead frame and chip is one of the key equipment of led production line. The swing-arm is an important component of led die bonder and its dynamic characteristics will directly affect the piece accuracy. At present, the accuracy and efficiency of led die bonder are limited because of the vibration of the swing-arm. In solving this problem, a three-dimensional finite-element model for swing-arm is built to provide analytical frequencies and vibration modes. Then the modal distribution and vibration mode shapes for swing-arm are obtained after analyzing the modal by ansys10.0. Finally the dynamics effects of this structure by modal frequency and vibration mode are analyzed. The modal analysis of structural would provide the reference to dynamics analysis and structural optimization for swing-arm in practical use.