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Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution
- Source :
- Diffusion and Defect Data Part B: Solid State Phenomena; November 2007, Vol. 134 Issue: 1 p333-336, 4p
- Publication Year :
- 2007
-
Abstract
- Not Available
Details
- Language :
- English
- ISSN :
- 10120394
- Volume :
- 134
- Issue :
- 1
- Database :
- Supplemental Index
- Journal :
- Diffusion and Defect Data Part B: Solid State Phenomena
- Publication Type :
- Periodical
- Accession number :
- ejs20122770
- Full Text :
- https://doi.org/10.4028/www.scientific.net/SSP.134.333