Effect of high pressure on interdiffusion in Cu-Zn alloys at temperatures near the melting point

Abstract: Interdiffusion of copper and zinc alloys of Cu-28.5 at. pct Zn and Cu-4.9 at. pct Zn has been investigated under pressures from 0.101 to 3240 MPa in the temperature range from 1256 to 1377 K. The diffusion coefficients decrease with increasing pressure. The activation energy for impurity diffusion of zinc in copper increases with pressure. The ratio of the activation volume to the molar volume of copper is between 0.75 and 0.90. It is concluded that the impurity diffusion of zinc in copper occurs predominantly by the monovacancy mechanism at temperatures near the melting point of the alloy.