Curing Behavior of Wood Adhesives Under High Steam Pressure

MLA

Umemura, Kenji, et al. “Curing Behavior of Wood Adhesives Under High Steam Pressure.” The Journal of Adhesion, vol. 59, no. 1, Aug. 1996, pp. 87–100. EBSCOhost, https://doi.org/10.1080/00218469608011079.

APA

Umemura, K., Kawai, S., Sasaki, H., Hamada, R., & Mizuno, Y. (1996). Curing Behavior of Wood Adhesives Under High Steam Pressure. The Journal of Adhesion, 59(1), 87–100. https://doi.org/10.1080/00218469608011079

Chicago

Umemura, Kenji, Shuichi Kawai, Hikaru Sasaki, Ryozo Hamada, and Yasusi Mizuno. 1996. “Curing Behavior of Wood Adhesives Under High Steam Pressure.” The Journal of Adhesion 59 (1): 87–100. doi:10.1080/00218469608011079.