Back to Search
Start Over
Thermal Analysis of MCM Packaging.
- Source :
- Electronics & Electrical Engineering; 2014, Vol. 20 Issue 5, p112-115, 4p
- Publication Year :
- 2014
-
Abstract
- This paper describes the use of infra-red thermography for the thermal study in the development stage of custom enclosures for multi-chip modules. Some limitations of conventional thermographic measurements are discussed and an approach for enhancing its application to quality control and diagnostics of faulty multi-chip module packages is proposed. The results from thermal measurements of radio-frequency range multi-chip module prototype in an open and a closed Quad Flat No Lead package are presented. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 13921215
- Volume :
- 20
- Issue :
- 5
- Database :
- Supplemental Index
- Journal :
- Electronics & Electrical Engineering
- Publication Type :
- Academic Journal
- Accession number :
- 96157077
- Full Text :
- https://doi.org/10.5755/j01.eee.20.5.7110