Investigation of the Virial Stress Distribution and its Relation with the Macroscopic Properties of a Single Crystal Copper Plate with an Elliptical Void.

In this paper different elliptical nano-void models in a single crystal copper are studied by using molecular dynamics method with the Embedded Atom potentials. By applying strain rate of 10⁹ 1/sec, we investigate distribution of virial stress per atom in the plate. Stress concentration factor is determined for different void shapes and crack lengths. By plotting stress-strain curves, it is shown that elastic modulus and maximum averaged stress (yield point) are more sensitive to the number of removed atoms than the sharpness of the void. Contrary to classical continuum mechanics, no infinite stress concentration is observed at the void tip when its curvature decreases to small values. [ABSTRACT FROM AUTHOR]