A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks.

MLA

Chuen-Ching Wang, et al. “A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks.” Journal of Electronic Packaging, vol. 131, no. 4, Dec. 2009, p. 41002. EBSCOhost, https://doi.org/10.1115/1.4000207.

APA

Chuen-Ching Wang, Wen-Ran Yang, Jin-Jia Chen, & Wei-Wen Shi. (2009). A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks. Journal of Electronic Packaging, 131(4), 41002. https://doi.org/10.1115/1.4000207

Chicago

Chuen-Ching Wang, Wen-Ran Yang, Jin-Jia Chen, and Wei-Wen Shi. 2009. “A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks.” Journal of Electronic Packaging 131 (4): 41002. doi:10.1115/1.4000207.