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The Wirebonded Interconnect: A Mainstay for Electronics.
- Source :
- Micro- & Opto-Electronic Materials & Structures: Physics, Mechanics, Design, Reliability, Packaging; 2007, pB71-B120, 1p
- Publication Year :
- 2007
Details
- Language :
- English
- ISBNs :
- 9780387279749
- Database :
- Supplemental Index
- Journal :
- Micro- & Opto-Electronic Materials & Structures: Physics, Mechanics, Design, Reliability, Packaging
- Publication Type :
- Book
- Accession number :
- 33185400
- Full Text :
- https://doi.org/10.1007/0-387-32989-7_23