Integrating Computational Fluid Dynamics and Neural Networks to Predict Temperature Distribution of the Semiconductor Chip with Multi-heat Sources.

In this paper, an artificial intelligent system to predict the temperature distribution of the semiconductor chip with multi-heat sources is presented by integrating the back-propagation neural network (BNN) and the computational fluid dynamics (CFD) techniques. Six randomly generated coordinates of three power sections on the chip die are the inputs and sixty-four temperature monitoring points on the top of the chip die are the outputs. In the present methodology, one hundred sets of training data obtained from the CFD simulations results were sent to the BNN for the intelligent training. There are other sixteen generated input sets to be the test data and compared the results between CFD simulation and BNN, it shows that the BNN model is able to accurately estimate the corresponding temperature distribution as well as the maximum temperature values under different power distribution after well trained. [ABSTRACT FROM AUTHOR]