Validation of a General Fatigue Life Prediction Methodology for Sn-Ag-Cu Lead-Free Solder Alloy Interconnects.

MLA

Pierce, David M., et al. “Validation of a General Fatigue Life Prediction Methodology for Sn-Ag-Cu Lead-Free Solder Alloy Interconnects.” Journal of Electronic Packaging, vol. 130, no. 1, Mar. 2008, pp. 10031-00312. EBSCOhost, https://doi.org/10.1115/1.2837515.

APA

Pierce, D. M., Sheppard, S. D., Vianco, P. T., Regent, J. A., & Grazier, J. M. (2008). Validation of a General Fatigue Life Prediction Methodology for Sn-Ag-Cu Lead-Free Solder Alloy Interconnects. Journal of Electronic Packaging, 130(1), 10031-00312. https://doi.org/10.1115/1.2837515

Chicago

Pierce, David M., Sheri D. Sheppard, Paul T. Vianco, Jerome A. Regent, and J. Mark Grazier. 2008. “Validation of a General Fatigue Life Prediction Methodology for Sn-Ag-Cu Lead-Free Solder Alloy Interconnects.” Journal of Electronic Packaging 130 (1): 10031-00312. doi:10.1115/1.2837515.