Effect of additives on the microstructure and properties of pulsed electrodeposited copper foils.

A low-roughness ultra-thin copper foil was prepared by pulsed electrodeposition with a duty cycle 60%, pulse frequency of 600 Hz on titanium. The influence of sodium 3,3'-dithiodipropane sulphonate (SPS), hydroxyethyl cellulose (HEC), gelatin and collagen additives on the microstructure, mechanical properties and electrochemical behaviour of electrolytic copper foil was explored. Furthermore, the reaction mechanism of SPS and collagen additives on electrodeposited copper were discussed. The results showed that at 0.08 g L⁻¹ collagen concentration, the lowest thickness, the highest microhardness and the optimal surface roughness were achieved (5.12 μm, 279.63 HV and 1.885 μm, respectively). X-ray diffraction results confirmed that electrolytic copper foils prepared when SPS was introduced into the blank solution had a preferred orientation of (220) texture, which benefitted from the synergistic effect of copper ions and additives. The intermediates formed by the additive and Cu⁺ occupied the active sites on the cathode surface that increased the nucleation sites for deposition. In addition, the formed complexes can act as a barrier to narrow ion deposition channels and inhibit the growth of Cu ions. [ABSTRACT FROM AUTHOR]