Key Aspects of the Processes of Thermal Decomposition of Complex Compounds of Copper Formate for Low-Temperature Printed Electronics.

Details

Language :

English

ISSN :

26376113

Volume :

5

Issue :

6

Database :

Supplemental Index

Journal :

ACS Applied Electronic Materials

Publication Type :

Academic Journal

Accession number :

164613521

Full Text :

https://doi.org/10.1021/acsaelm.3c00281