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A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces.

Authors :
Feng, Tianli
Zhou, Hao
Cheng, Zhe
Larkin, Leighann Sarah
Neupane, Mahesh R.
Source :
ACS Applied Materials & Interfaces; 6/28/2023, Vol. 15 Issue 25, p29655-29673, 19p
Publication Year :
2023

Details

Language :
English
ISSN :
19448244
Volume :
15
Issue :
25
Database :
Supplemental Index
Journal :
ACS Applied Materials & Interfaces
Publication Type :
Academic Journal
Accession number :
164613248
Full Text :
https://doi.org/10.1021/acsami.3c02507