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A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces.
- Source :
- ACS Applied Materials & Interfaces; 6/28/2023, Vol. 15 Issue 25, p29655-29673, 19p
- Publication Year :
- 2023
Details
- Language :
- English
- ISSN :
- 19448244
- Volume :
- 15
- Issue :
- 25
- Database :
- Supplemental Index
- Journal :
- ACS Applied Materials & Interfaces
- Publication Type :
- Academic Journal
- Accession number :
- 164613248
- Full Text :
- https://doi.org/10.1021/acsami.3c02507