Effect of process parameters on growth pattern of micro-nickel column in mask-less localized electrodeposition.

The additive manufacturing of mask-less localized electrodeposition technology is a new technology that combines the principle of electrochemical deposition with additive manufacturing. Micro-nickel columns were prepared by this technique under low voltage/small duty cycle, high voltage/large duty cycle, and high voltage/small duty cycle. The surface morphology, deposition rate, cross-section structure, and growth pattern of micro-nickel columns were studied to understand the formation process of micro-nickel columns and obtain high-quality micronickel columns. The research found that the diameter of the deposited micro-nickel column is uniform, the grain is fine and smooth under low voltage/small duty cycle (4.2V/0.3). The micro-nickel columns deposited under high voltage/large duty cycle conditions (4.8V/0.7) were thickerin diameter, but the particles were irregularly stacked. The volume deposition rate increases with the increase of voltage and duty cycle. The volume deposition rate is the highest when the duty cycle is 0.5. Three growth patterns are proposed: the layer-by-layer deposition in the initial deposition phase, accumulation deposition in the middle phase, and mixed deposition in the final phase. These three growth patterns are based on the surface morphology and cross-section microstructure of the micro-nickel column deposited under a high voltage/small duty cycle [ABSTRACT FROM AUTHOR]