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Quantitative mechanisms behind the high strength and electrical conductivity of Cu-Te alloy manufactured by continuous extrusion.
- Source :
- Journal of Materials Science & Technology; Sep2022, Vol. 121, p9-18, 10p
- Publication Year :
- 2022
-
Abstract
- • The continuous extrusion refines the grain size of Cu-Te alloy significantly by incomplete dynamic recrystallization. • Cu 2 Te phase stimulates the formation of recrystallization and inhibit subgrain growth. • The increments caused by dislocation strengthening and boundary strengthening account for 84.6% of the yield strength of the extruded Cu-Tealloy and the electrical resistivity induced by grain boundaries and dislocations accounts for 1.6% of the electrical resistivity of the extruded Cu-Te alloy. • Dislocations and boundaries contribute greatly to the increase of yield strength, but less to the increase of electrical resistivity. The microstructure, mechanical performance, and electrical conductivity of Cu-Te alloy fabricated by continuous extrusion were quantitatively investigated. The results demonstrate that the grain size of the Cu-Te alloy is refined significantly by incomplete dynamic recrystallization. The Cu 2 Te phase stimulates recrystallization and inhibits subgrain growth. After extrusion, the tensile strength increases from 217.8 ± 4.8 MPa to 242.5 ± 3.7 MPa, the yield strength increases from 65.1 ± 3.5 MPa to 104.3 ± 3.8 MPa, and the yield to tensile strength ratio is improved from 0.293 ± 0.015 to 0.43 ±.0.091, while the electrical conductivity of room temperature decreases from 95.8 ± 0.38% International Annealed Cu Standard (IACS) to 94.0% ± 0.32% IACS. The quantitative analysis shows that the increment caused by dislocation strengthening and boundary strengthening account for 84.6% of the yield strength of the extruded Cu-Te alloy and the electrical resistivity induced by grain boundaries and dislocations accounts for 1.6% of the electrical resistivity of the extruded Cu-Te alloy. Dislocations and boundaries contribute greatly to the increase of yield strength, but less to the increase of electrical resistivity. [Display omitted] [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 10050302
- Volume :
- 121
- Database :
- Supplemental Index
- Journal :
- Journal of Materials Science & Technology
- Publication Type :
- Periodical
- Accession number :
- 156855957
- Full Text :
- https://doi.org/10.1016/j.jmst.2021.12.046