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3D Covalent Organic Frameworks with Interpenetrated pcb Topology Based on 8‑Connected Cubic Nodes.

Authors :
Shan, Zhen
Wu, Miaomiao
Zhu, Dongyang
Wu, Xiaowei
Zhang, Kan
Verduzco, Rafael
Zhang, Gen
Source :
Journal of the American Chemical Society; 4/6/2022, Vol. 144 Issue 13, p5728-5733, 6p
Publication Year :
2022

Details

Language :
English
ISSN :
00027863
Volume :
144
Issue :
13
Database :
Supplemental Index
Journal :
Journal of the American Chemical Society
Publication Type :
Academic Journal
Accession number :
156321487
Full Text :
https://doi.org/10.1021/jacs.2c01037