Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns.

MLA

Li, Jiujuan, et al. “Polymer-Based Cu/Ag Composite as Seed Layer on Insulating Substrate for Copper Addition of Multi-Dimensional Conductive Patterns.” Journal of the Taiwan Institute of Chemical Engineers, vol. 123, June 2021, pp. 254–60. EBSCOhost, https://doi.org/10.1016/j.jtice.2021.05.033.

APA

Li, J., Hong, Y., Zhou, G., Zhang, H., He, W., Wang, S., Chen, Y., Wang, C., Su, X., Sun, Y., & Andersson, M. (2021). Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns. Journal of the Taiwan Institute of Chemical Engineers, 123, 254–260. https://doi.org/10.1016/j.jtice.2021.05.033

Chicago

Li, Jiujuan, Yan Hong, Guoyun Zhou, Huaiwu Zhang, Wei He, Shouxu Wang, Yuanming Chen, et al. 2021. “Polymer-Based Cu/Ag Composite as Seed Layer on Insulating Substrate for Copper Addition of Multi-Dimensional Conductive Patterns.” Journal of the Taiwan Institute of Chemical Engineers 123 (June): 254–60. doi:10.1016/j.jtice.2021.05.033.