Cite
Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition.
MLA
Mirhashemihaghighi, Shadi, et al. “Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition.” Journal of The Electrochemical Society, vol. 162, no. 8, Aug. 2015, pp. C377–84. EBSCOhost, https://doi.org/10.1149/2.0081508jes.
APA
Mirhashemihaghighi, S., Światowska, J., Maurice, V., Seyeux, A., Klein, L. H., Härkönen, E., Ritala, M., & Marcus, P. (2015). Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition. Journal of The Electrochemical Society, 162(8), C377–C384. https://doi.org/10.1149/2.0081508jes
Chicago
Mirhashemihaghighi, Shadi, Jolanta Światowska, Vincent Maurice, Antoine Seyeux, Lorena H. Klein, Emma Härkönen, Mikko Ritala, and Philippe Marcus. 2015. “Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition.” Journal of The Electrochemical Society 162 (8): C377–84. doi:10.1149/2.0081508jes.