The Use of Polymeric Technologies for Functional 3D Microdevices.

In this paper we present the benefits of combining microinjection moulding technology with flexible elements for the realization of 3D microdevices with added functionality. Microinjection moulding technology enables the fabrication of low-weight micro-parts with great design flexibility. Polyimide is a known flexible material for its electrical and thermal insulation and mechanical strength that can easily be processed for microelectronic applications. Although widely used, silicon microdevices have limitations on their configuration (typical silicon devices have a planar geometry) and therefore, are not suitable for some applications requiring complex and small tridimensional geometries. Placement of smart elements within polymeric micro-parts adds functionality and enables an increased integration and 3D configurations. In this work, integrated 3DOF (degrees-of-freedom) and 1DOF thermal accelerometers are fabricated using the proposed fabrication technology demonstrating the viability of the concept. Experimental measurements using the 1DOF devices show a sensitivity of 15 mV/g (at 10 Hz), a bandwidth of 14 Hz and a power consumption of 28.7mW. [ABSTRACT FROM AUTHOR]