Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection.

Details

Language :

English

ISBNs :

9781479938605

Database :

Complementary Index

Journal :

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials & Devices & Workshop on Piezoresponse Force Microscopy

Publication Type :

Conference

Accession number :

99488576

Full Text :

https://doi.org/10.1109/ISAF.2014.6917893