Integration study of die strength and various bumping volume and reliability performance on 2.5D silicon interposer assembly.

Details

Language :

English

ISBNs :

9781479924073

Database :

Complementary Index

Journal :

2014 IEEE 64th Electronic Components & Technology Conference (ECTC)

Publication Type :

Conference

Accession number :

98878541

Full Text :

https://doi.org/10.1109/ECTC.2014.6897258