Electromagnetic Modeling and Simulation for Packaging Structures with Lossy Conductors.

Accurate electromagnetic (EM) analysis for interconnect structures requires to consider the finite conductivity of involved conductors. The conductor loss could be accounted for through an approximate surface impedance when the skin depth of current is small. However, this approximation may not be valid for large skin depth caused by low frequencies or small conductivities. In this work, we treat the lossy conductors as homogeneous dielectric media and use electric field integral equations (EFIEs) to describe the problem. The EFIEs are solved with the method of moments (MoM) in which the Rao-Wilton-Glisson (RWG) and dual basis functions are used to represent the electric and magnetic current densities, respectively. A numerical example is presented to demonstrate the approach. [ABSTRACT FROM AUTHOR]