Impact of replacing Sn-Ag bumps with Cu pillars on the BEoL Cu/Low-k fracture under reflow - a computational study.

Details

Language :

English

ISBNs :

9781479952670

Database :

Complementary Index

Journal :

Fourteenth Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm)

Publication Type :

Conference

Accession number :

98467884

Full Text :

https://doi.org/10.1109/ITHERM.2014.6892319