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A novel 3D IC assembly process for ultra-thin chip stacking.
- Source :
- 2014 International Conference on Electronics Packaging (ICEP); 2014, p470-474, 5p
- Publication Year :
- 2014
Details
- Language :
- English
- ISBNs :
- 9784904090114
- Database :
- Complementary Index
- Journal :
- 2014 International Conference on Electronics Packaging (ICEP)
- Publication Type :
- Conference
- Accession number :
- 98459165
- Full Text :
- https://doi.org/10.1109/ICEP.2014.6826723